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NXP Semiconductors S9S08RN8W2MLC Microcontroller, Microprocessor, FPGA Modules

IC MCU 8BIT 8KB FLASH 32LQFP

44,913 ActiveNXP Semiconductors32-LQFPRoHS
S9S08RN8W2MLC - No Image Available

Same model may have multiple batches, images only for reference.

S9S08RN8W2MLC
Manufacturer
Part Number (MPN)
S9S08RN8W2MLC
Detailed Description
IC MCU 8BIT 8KB FLASH 32LQFP
Package
32-LQFP
Key Features
Package / Case: 32-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF S9S08RN8W2MLC Datasheet
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Technical Specifications

NXP Semiconductors S9S08RN8W2MLC Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
2K x 8
Package / Case
32-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.7V ~ 5.5V
Peripherals
LVD, POR, PWM, WDT
Number of I/O
26
Speed
20MHz
EEPROM Size
256 x 8
Core Processor
S08

Alternate Parts Comparison (S9S08RN8W2MLC vs S9S12VR48AAVLCR vs MC9S08AC16CFJER vs MC9S08FL8CLC)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case32-LQFP32-LQFP32-LQFP32-LQFP
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 105°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage2.7V ~ 5.5V3.5V ~ 40V2.7V ~ 5.5V4.5V ~ 5.5V
Core ProcessorS08HCS12S08S08
Core Size8-Bit16-Bit8-Bit8-Bit
RAM Size2K x 82K x 81K x 8768 x 8
ConnectivityI²C, LINbus, SPI, UART/USARTIrDA, LINbus, SCI, SPII²C, SCI, SPISCI
Data ConvertersA/D 12x12bA/D 2x10bA/D 6x10bA/D 12x8b
Oscillator TypeInternalExternal, InternalInternalInternal
PeripheralsLVD, POR, PWM, WDTLVD, POR, PWM, WDTLVD, POR, PWM, WDTLVD, PWM, WDT
Program Memory Size8KB (8K x 8)48KB (48K x 8)16KB (16K x 8)8KB (8K x 8)
Program Memory TypeFlashFlashFlashFlash
Action

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