NXP Semiconductors S912ZVMAL3F0MLC Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 32KB FLASH 32LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
S912ZVMAL3F0MLC
Detailed Description
IC MCU 16BIT 32KB FLASH 32LQFP
Package
32-LQFP
Key Features
Package / Case: 32-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
S912ZVMAL3F0MLC Datasheet
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Technical Specifications
NXP Semiconductors S912ZVMAL3F0MLC Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
2K x 8
RoHS
Yes
Package / Case
32-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
3.5V ~ 20V
Lifecycle Status
Active
Peripherals
PWM, WDT
Number of I/O
10
Speed
32MHz
Related Parts Comparison (S912ZVMAL3F0MLC vs S9S12VR48AAVLCR vs MC9S08AC16CFJER vs MC9S08FL8CLC)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Package / Case | 32-LQFP | 32-LQFP | 32-LQFP | 32-LQFP |
| Operating Temperature | -40°C ~ 125°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 3.5V ~ 20V | 3.5V ~ 40V | 2.7V ~ 5.5V | 4.5V ~ 5.5V |
| Core Processor | S12Z | HCS12 | S08 | S08 |
| Core Size | 16-Bit | 16-Bit | 8-Bit | 8-Bit |
| RAM Size | 2K x 8 | 2K x 8 | 1K x 8 | 768 x 8 |
| RoHS | Yes | Yes | Yes | Yes |
| Lifecycle Status | Active | Active | Active | Active |
| Connectivity | LINbus, SCI, SPI | IrDA, LINbus, SCI, SPI | I²C, SCI, SPI | SCI |
| Data Converters | A/D 4x10b | A/D 2x10b | A/D 6x10b | A/D 12x8b |
| Number of I/O | 10 | 16 | 22 | 30 |
| Oscillator Type | Internal | External, Internal | Internal | Internal |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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