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NXP Semiconductors S912XHZ512F1CAL Microcontroller, Microprocessor, FPGA Modules

IC MCU 16BIT 512KB FLASH 112LQFP

2,482NXP Semiconductors112-LQFPRoHS
S912XHZ512F1CAL 112-LQFP package illustration

Same model may have multiple batches, images only for reference.

S912XHZ512F1CAL
Manufacturer
Part Number (MPN)
S912XHZ512F1CAL
Detailed Description
IC MCU 16BIT 512KB FLASH 112LQFP
Package
112-LQFP
Key Features
Package / Case: 112-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF S912XHZ512F1CAL Datasheet
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Technical Specifications

NXP Semiconductors S912XHZ512F1CAL Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
32K x 8
RoHS
Yes
Package / Case
112-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.35V ~ 5.5V
Lifecycle Status
Obsolete
Peripherals
LCD, Motor control PWM, POR, PWM, WDT
Number of I/O
85
Speed
80MHz

Related Parts Comparison (S912XHZ512F1CAL vs S912XEG128BCAL vs S912XEP100J4MAL vs MC9S12B128CPVE)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case112-LQFP112-LQFP112-LQFP112-LQFP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)
Supply Voltage2.35V ~ 5.5V1.72V ~ 5.5V1.72V ~ 5.5V2.35V ~ 5.5V
Core ProcessorHCS12XHCS12XHCS12XHCS12
Core Size16-Bit16-Bit16-Bit16-Bit
RAM Size32K x 812K x 864K x 84K x 8
RoHSYesYesYesYes
Lifecycle StatusObsoleteActiveActiveObsolete
ConnectivityCANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPICANbus, EBI/EMI, I²C, IrDA, SCI, SPICANbus, EBI/EMI, I²C, IrDA, SCI, SPICANbus, I²C, SCI, SPI
Data ConvertersA/D 16x8/10bA/D 16x12bA/D 16x12bA/D 16x10b
EEPROM Size4K x 82K x 84K x 81K x 8
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