NXP Semiconductors S912XEG256BVAL Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 256KB FLASH 112LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
S912XEG256BVAL
Detailed Description
IC MCU 16BIT 256KB FLASH 112LQFP
Package
112-LQFP
Key Features
Package / Case: 112-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
S912XEG256BVAL Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors S912XEG256BVAL Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
16K x 8
Package / Case
112-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
1.72V ~ 5.5V
Lifecycle Status
Active
Peripherals
LVD, POR, PWM, WDT
Number of I/O
91
Speed
50MHz
EEPROM Size
4K x 8
Alternate Parts Comparison (S912XEG256BVAL vs S912XEG128BCAL vs S912XEP100J4MAL vs MC9S12B128CPVE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 1.72V ~ 5.5V | 1.72V ~ 5.5V | 1.72V ~ 5.5V | 2.35V ~ 5.5V |
| Core Processor | HCS12X | HCS12X | HCS12X | HCS12 |
| Core Size | 16-Bit | 16-Bit | 16-Bit | 16-Bit |
| RAM Size | 16K x 8 | 12K x 8 | 64K x 8 | 4K x 8 |
| Connectivity | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | CANbus, I²C, SCI, SPI |
| Data Converters | A/D 16x12b | A/D 16x12b | A/D 16x12b | A/D 16x10b |
| EEPROM Size | 4K x 8 | 2K x 8 | 4K x 8 | 1K x 8 |
| Number of I/O | 91 | 91 | 91 | 91 |
| Oscillator Type | External | External | External | Internal |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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