NXP Semiconductors P89LPC925FN,129 Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 8KB FLASH 20DIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
P89LPC925FN,129
Detailed Description
IC MCU 8BIT 8KB FLASH 20DIP
Package
20-DIP (0.300", 7.62mm)
Key Features
Package / Case: 20-DIP (0.300", 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
P89LPC925FN,129 Datasheet
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Technical Specifications
NXP Semiconductors P89LPC925FN,129 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
LPC900
RAM Size
256 x 8
RoHS
Yes
Package / Case
20-DIP
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.4V ~ 3.6V
Lifecycle Status
Obsolete
Peripherals
Brown-out Detect/Reset, LED, POR, PWM, WDT
Number of I/O
18
Alternate Parts Comparison (P89LPC925FN,129 vs MC908KK3ECPE vs MC68HC705J1ACPE vs P87LPC762BN)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Series | LPC900 | HC08 | HC05 | LPC700 |
| Package / Case | 20-DIP | 20-DIP | 20-DIP | 20-DIP |
| Mounting Type | Through Hole | Through Hole | Through Hole | Through Hole |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | 0°C ~ 70°C (TA) |
| Core Processor | 8051 | HC08 | HC05 | 8051 |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 256 x 8 | 128 x 8 | 64 x 8 | 128 x 8 |
| RoHS | Yes | Yes | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Active |
| Number of I/O | 18 | 23 | 14 | 18 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Package | 20-DIP | 20-DIP (0.300", 7.62mm) | PDIP-20 | 20-DIP |
| Action |
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