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NXP Semiconductors P87LPC767BN,112 Microcontroller, Microprocessor, FPGA Modules

IC MCU 8BIT 4KB OTP 20DIP

2,962NXP Semiconductors20-DIP (0.300", 7.62mm)RoHS
P87LPC767BN,112 20-DIP (0.300", 7.62mm) package illustration

Same model may have multiple batches, images only for reference.

P87LPC767BN,112
Manufacturer
Part Number (MPN)
P87LPC767BN,112
Detailed Description
IC MCU 8BIT 4KB OTP 20DIP
Package
20-DIP (0.300", 7.62mm)
Key Features
Package / Case: 20-DIP (0.300", 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF P87LPC767BN,112 Datasheet
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Technical Specifications

NXP Semiconductors P87LPC767BN,112 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
128 x 8
Package / Case
20-DIP
Mounting Type
Through Hole
Operating Temperature
0°C ~ 70°C (TA)
Supply Voltage
2.7V ~ 6V
Lifecycle Status
Obsolete
Peripherals
Brown-out Detect/Reset, LED, POR, WDT
Number of I/O
18
Speed
20MHz
Core Processor
8051

Alternate Parts Comparison (P87LPC767BN,112 vs MC908KK3ECPE vs MC68HC705J1ACPE vs P87LPC762BN)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case20-DIP20-DIP20-DIP20-DIP
Mounting TypeThrough HoleThrough HoleThrough HoleThrough Hole
Operating Temperature0°C ~ 70°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)0°C ~ 70°C (TA)
Core Processor8051HC08HC058051
Core Size8-Bit8-Bit8-Bit8-Bit
RAM Size128 x 8128 x 864 x 8128 x 8
Lifecycle StatusObsoleteObsoleteObsoleteActive
Number of I/O18231418
Oscillator TypeInternalInternalInternalInternal
Program Memory Size4KB (4K x 8)4KB (4K x 8)1.2KB (1.2K x 8)2KB (2K x 8)
Program Memory TypeOTPFlashOTPOTP
Speed20MHz8MHz4MHz20MHz
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