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NXP Semiconductors MKL17Z256VFM4R Microcontroller, Microprocessor, FPGA Modules

KINETIS KL17: 48MHZ CORTEX-M0+ U

14,991 ActiveNXP Semiconductors32-VFQFN Exposed PadRoHS
MKL17Z256VFM4R - No Image Available

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MKL17Z256VFM4R
Manufacturer
Part Number (MPN)
MKL17Z256VFM4R
Detailed Description
KINETIS KL17: 48MHZ CORTEX-M0+ U
Package
32-VFQFN Exposed Pad
Key Features
Package / Case: 32-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MKL17Z256VFM4R Datasheet
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Technical Specifications

NXP Semiconductors MKL17Z256VFM4R Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
Kinetis KL17
RAM Size
32K x 8
Package / Case
32-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
1.71V ~ 3.6V
Peripherals
Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Number of I/O
28
Speed
48MHz
Core Processor
ARM® Cortex®-M0+

Alternate Parts Comparison (MKL17Z256VFM4R vs MKL15Z64VFM4R vs MKL26Z128VFM4 vs A7001CGHN1/T1AGAEL)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case32-VFQFN Exposed Pad32-VFQFN Exposed Pad32-VFQFN Exposed Pad32-VFQFN Exposed Pad
Mounting TypeSurface MountSurface Mount, Wettable FlankSurface Mount, Wettable FlankSurface Mount
Operating Temperature-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)-25°C ~ 85°C
Supply Voltage1.71V ~ 3.6V1.71V ~ 3.6V1.71V ~ 3.6V1.62V ~ 5.5V
Core ProcessorARM® Cortex®-M0+ARM® Cortex®-M0+ARM® Cortex®-M0+MX51
RAM Size32K x 88K x 816K x 83.2kB
Program Memory TypeFlashFlashFlashEEPROM (76.4kB)
Core Size32-Bit32-Bit Single-Core32-Bit Single-Core--
ConnectivityI²C, LINbus, SPI, UART/USARTI²C, LINbus, SPI, TSI, UART/USARTI²C, LINbus, SPI, UART/USART, USB, USB OTG--
Data ConvertersA/D 11x16b SAR; D/A 1x12bA/D 9x16b; D/A 1x12bA/D - 16bit; D/A - 12bit--
Number of I/O282823--
Oscillator TypeInternalInternalInternal--
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