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NXP Semiconductors LPC824M201JHI33K Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 32KB FLASH 32HVQFN

31,716 ActiveNXP Semiconductors32-VFQFN Exposed PadRoHS
LPC824M201JHI33K 32-VFQFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

LPC824M201JHI33K
Manufacturer
Part Number (MPN)
LPC824M201JHI33K
Detailed Description
IC MCU 32BIT 32KB FLASH 32HVQFN
Package
32-VFQFN Exposed Pad
Key Features
Package / Case: 32-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF LPC824M201JHI33K Datasheet
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Technical Specifications

NXP Semiconductors LPC824M201JHI33K Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
8K x 8
RoHS
Yes
Package / Case
32-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
1.8V ~ 3.6V
Lifecycle Status
Active
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O
29
Speed
30MHz

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Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case32-VFQFN Exposed Pad32-VFQFN Exposed Pad32-VFQFN Exposed Pad32-VFQFN Exposed Pad
Mounting TypeSurface MountSurface MountSurface Mount, Wettable FlankSurface Mount, Wettable Flank
Operating Temperature-40°C ~ 105°C (TA)-25°C ~ 85°C-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)
Supply Voltage1.8V ~ 3.6V1.62V ~ 5.5V5.5V ~ 18V5.5V ~ 18V
Core ProcessorARM® Cortex®-M0+MX51S12ZS12Z
RAM Size8K x 83.2kB1K x 81K x 8
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveActive
Package32-VFQFNExposedPadHVQFN EP-32QFN-32QFN-32
Program Memory TypeFlashEEPROM (76.4kB)FlashFlash
Core Size32-Bit Single-Core--16-Bit16-Bit
ConnectivityI²C, SPI, UART/USART--I²C, IrDA, LINbus, SCI, SPI, UART/USARTI²C, IrDA, LINbus, SCI, SPI, UART/USART
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