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NXP Semiconductors MCZ33689DEW Power Management - Specialized

IC SYSTEM BASIS CHIP LIN 32-SOIC

2,018NXP Semiconductors32-BSSOP (0.295", 7.50mm Width)RoHS
MCZ33689DEW - No Image Available

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MCZ33689DEW
Manufacturer
Part Number (MPN)
MCZ33689DEW
Detailed Description
IC SYSTEM BASIS CHIP LIN 32-SOIC
Package
32-BSSOP (0.295", 7.50mm Width)
Key Features
Package / Case: 32-BSSOP (0.295", 7.50mm Width); Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF MCZ33689DEW Datasheet
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Technical Specifications

NXP Semiconductors MCZ33689DEW Power Management - Specialized technical specifications.

General

Package / Case
32-BSSOP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C
Supply Voltage
5.5V ~ 18V
Lifecycle Status
Obsolete
Current Supply
5mA
Applications
Automotive

Alternate Parts Comparison (MCZ33689DEW vs MCZ33996EKR2 vs MCZ33291LEGR2 vs MCZ33996EK)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case32-BSSOP32-SSOP24-SOIC32-SSOP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C-40°C ~ 150°C (TJ)-40°C ~ 150°C (TJ)-40°C ~ 150°C (TJ)
Supply Voltage5.5V ~ 18V3.1V ~ 5.5V4.5V ~ 5.5V3.1V ~ 5.5V
Interface--SPISPISPI
Current Output Max--900mA500mA900mA
Fault Protection--Current Limiting (Fixed), Open Load Detect, Over Temperature, OverCurrent Limiting (Fixed), Open Load Detect, Over Temperature, OverCurrent Limiting (Fixed), Open Load Detect, Over Temperature, Over
Number of Outputs--16816
Output Configuration--Low SideLow SideLow Side
Output Type--N-ChannelN-ChannelN-Channel
Ratio Input Output--1:161:81:16
Rds on Typ--550mOhm1.1Ohm550mOhm
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