NXP Semiconductors MCIMX233DAG4C Microcontroller, Microprocessor, FPGA Modules
IC MPU I.MX23 454MHZ 128LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MCIMX233DAG4C
Detailed Description
IC MPU I.MX23 454MHZ 128LQFP
Package
128-LQFP
Key Features
Package / Case: 128-LQFP
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MCIMX233DAG4C Datasheet
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Technical Specifications
NXP Semiconductors MCIMX233DAG4C Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RoHS
Yes
Package / Case
128-LQFP
Operating Temperature
-10°C ~ 70°C (TA)
Lifecycle Status
Active
Voltage IO
2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Speed
454MHz
Core Processor
ARM926EJ-S
Number of Cores Bus Width
1 Core, 32-Bit
Co Processors DSP
Data; DCP
RAM Controllers
DRAM
Related Parts Comparison (MCIMX233DAG4C vs MCIMX6D5EYM10AER vs MCIMX6D6AVT08ADR vs MCIMX6D6AVT08AE)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Package / Case | 128-LQFP | 624-LFBGA, FCBGA | 624-FBGA | 624-FBGA |
| Operating Temperature | -10°C ~ 70°C (TA) | -20°C ~ 105°C (TJ) | -40°C ~ 125°C (TJ) | -40°C ~ 125°C (TJ) |
| Core Processor | ARM926EJ-S | ARM® Cortex®-A9 | ARM® Cortex®-A9 | ARM® Cortex®-A9 |
| RoHS | Yes | Yes | Yes | Yes |
| Lifecycle Status | Active | Active | Active | Active |
| Co Processors DSP | Data; DCP | Multimedia; NEON™ SIMD | Multimedia; NEON™ SIMD | Multimedia; NEON™ SIMD |
| Display and Interface Controllers | LCD, Touchscreen | Keypad, LCD | Keypad, LCD | Keypad, LCD |
| Graphics Acceleration | No | Yes | Yes | Yes |
| Number of Cores Bus Width | 1 Core, 32-Bit | 2 Core, 32-Bit | 2 Core, 32-Bit | 2 Core, 32-Bit |
| Package | LQFP128 | 624-LFBGA, FCBGA | FCPBGA-624 | SOT1643-1 |
| RAM Controllers | DRAM | LPDDR2, LVDDR3, DDR3 | LPDDR2, LVDDR3, DDR3 | LPDDR2, LVDDR3, DDR3 |
| Security Features | Cryptography, Hardware ID | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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