NXP Semiconductors MC56F8365MFGE Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 512KB FLASH 128LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC56F8365MFGE
Detailed Description
IC MCU 16BIT 512KB FLASH 128LQFP
Package
128-LQFP
Key Features
Package / Case: 128-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC56F8365MFGE Datasheet
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Technical Specifications
NXP Semiconductors MC56F8365MFGE Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
18K x 16
RoHS
Yes
Package / Case
128-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.25V ~ 3.6V
Lifecycle Status
Active
Peripherals
POR, PWM, Temp Sensor, WDT
Number of I/O
49
Speed
60MHz
Related Parts Comparison (MC56F8365MFGE vs MC705P6ACDWE vs MC711K4CFNE4 vs MC56F8165VFGE)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Package / Case | 128-LQFP | 28-SOIC | 84-LCC | 128-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) |
| Supply Voltage | 2.25V ~ 3.6V | 5 V | 4.5V ~ 5.5V | 2.25V ~ 3.6V |
| Core Processor | 56800E | HC05 | HC11 | 56800E |
| Core Size | 16-Bit | 8-Bit | 8-Bit | 16-Bit |
| RAM Size | 18K x 16 | 176 B | 768 x 8 | 16K x 16 |
| Lifecycle Status | Active | Not For New Designs | Obsolete | Active |
| Connectivity | CANbus, EBI/EMI, SCI, SPI | SIO | SCI, SPI | EBI/EMI, SCI, SPI |
| Data Converters | A/D 16x12b | A/D 4x8b | A/D 8x8b | A/D 16x12b |
| Number of I/O | 49 | 21 | 62 | 49 |
| Oscillator Type | External | Internal | Internal | External |
| Action |
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