NXP Semiconductors MC9S12XDP512CAL Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 512KB FLASH 112LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S12XDP512CAL
Detailed Description
IC MCU 16BIT 512KB FLASH 112LQFP
Package
112-LQFP
Key Features
Package / Case: 112-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC9S12XDP512CAL Datasheet
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Technical Specifications
NXP Semiconductors MC9S12XDP512CAL Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
32K x 8
Package / Case
112-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.35V ~ 5.5V
Lifecycle Status
Active
Peripherals
LVD, POR, PWM, WDT
Number of I/O
91
Speed
80MHz
EEPROM Size
4K x 8
Alternate Parts Comparison (MC9S12XDP512CAL vs MC9S12B128CPVE vs MC9S12XDT256MAL vs MC9S12KT256MPVE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) |
| Supply Voltage | 2.35V ~ 5.5V | 2.35V ~ 5.5V | 2.35V ~ 5.5V | 2.35V ~ 5.5V |
| Core Processor | HCS12X | HCS12 | HCS12X | HCS12 |
| Core Size | 16-Bit | 16-Bit | 16-Bit | 16-Bit |
| RAM Size | 32K x 8 | 4K x 8 | 16K x 8 | 12K x 8 |
| Connectivity | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | CANbus, I²C, SCI, SPI | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | CANbus, EBI/EMI, I²C, SCI, SPI |
| Data Converters | A/D 16x10b | A/D 16x10b | A/D 16x10b | A/D 16x10b |
| EEPROM Size | 4K x 8 | 1K x 8 | 4K x 8 | 4K x 8 |
| Number of I/O | 91 | 91 | 91 | 91 |
| Oscillator Type | External | Internal | External | Internal |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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