NXP Semiconductors MC9S12NE64CPV Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 64KB FLASH 112LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S12NE64CPV
Detailed Description
IC MCU 16BIT 64KB FLASH 112LQFP
Package
112-LQFP
Key Features
Package / Case: 112-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
MC9S12NE64CPV Datasheet
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Technical Specifications
NXP Semiconductors MC9S12NE64CPV Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
Microcontroller
RAM Size
8K x 8
Data Bus Width
16 bit
Maximum Clock Frequency
25 MHz
RoHS
True
Package / Case
112-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.375V ~ 3.465V
Lifecycle Status
Obsolete
Alternate Parts Comparison (MC9S12NE64CPV vs MC9S12B128CPVE vs MC9S12XDT256MAL vs MC9S12KT256MPVE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) |
| Supply Voltage | 2.375V ~ 3.465V | 2.35V ~ 5.5V | 2.35V ~ 5.5V | 2.35V ~ 5.5V |
| Core Processor | HCS12 | HCS12 | HCS12X | HCS12 |
| Core Size | 16-Bit | 16-Bit | 16-Bit | 16-Bit |
| RAM Size | 8K x 8 | 4K x 8 | 16K x 8 | 12K x 8 |
| Connectivity | EBI/EMI, Ethernet, I²C, SCI, SPI | CANbus, I²C, SCI, SPI | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | CANbus, EBI/EMI, I²C, SCI, SPI |
| Data Converters | A/D 8x10b | A/D 16x10b | A/D 16x10b | A/D 16x10b |
| Number of I/O | 70 | 91 | 91 | 91 |
| Oscillator Type | Internal | Internal | External | Internal |
| Peripherals | POR, PWM, WDT | POR, PWM, WDT | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT |
| Action |
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