NXP Semiconductors MC9S12C32MPB25 Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 32KB FLASH 52TQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S12C32MPB25
Detailed Description
IC MCU 16BIT 32KB FLASH 52TQFP
Package
52-LQFP
Key Features
Package / Case: 52-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
MC9S12C32MPB25 Datasheet
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Technical Specifications
NXP Semiconductors MC9S12C32MPB25 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
2K x 8
Package / Case
52-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.35V ~ 5.5V
Lifecycle Status
Obsolete
Peripherals
POR, PWM, WDT
Number of I/O
35
Speed
25MHz
Core Processor
HCS12
Alternate Parts Comparison (MC9S12C32MPB25 vs MC11E1CPBE2R vs MC68HC908LV8CPBE vs MC9S12C32VPBE16)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 52-LQFP | 52-LQFP | 52-LQFP | 52-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) |
| Supply Voltage | 2.35V ~ 5.5V | 4.5V ~ 5.5V | 2.7V ~ 5.5V | 2.35V ~ 5.5V |
| Core Processor | HCS12 | HC11 | HC08 | HCS12 |
| Core Size | 16-Bit | 8-Bit | 8-Bit | 16-Bit |
| RAM Size | 2K x 8 | 512 x 8 | 512 x 8 | 2K x 8 |
| Data Converters | A/D 8x10b | A/D 8x8b | A/D 6x10b | A/D 8x10b |
| Number of I/O | 35 | 38 | 40 | 35 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Peripherals | POR, PWM, WDT | POR, WDT | LCD, LVD, POR, PWM | POR, PWM, WDT |
| Program Memory Type | Flash | ROMless | Flash | Flash |
| Action |
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