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NXP Semiconductors MC9S12C32CPBE25 Microcontroller, Microprocessor, FPGA Modules

IC MCU 16BIT 32KB FLASH 52TQFP

3,039NXP Semiconductors52-LQFPRoHS
MC9S12C32CPBE25 52-LQFP package illustration

Same model may have multiple batches, images only for reference.

MC9S12C32CPBE25
Manufacturer
Part Number (MPN)
MC9S12C32CPBE25
Detailed Description
IC MCU 16BIT 32KB FLASH 52TQFP
Package
52-LQFP
Key Features
Package / Case: 52-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Not For New Designs
RoHS State
RoHS Compliant
Datasheet
PDF MC9S12C32CPBE25 Datasheet
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Technical Specifications

NXP Semiconductors MC9S12C32CPBE25 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
2K x 8
RoHS
Yes
Package / Case
52-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.35V ~ 5.5V
Lifecycle Status
Not For New Designs
Peripherals
POR, PWM, WDT
Number of I/O
35
Speed
25MHz

Related Parts Comparison (MC9S12C32CPBE25 vs MC11E1CPBE2R vs MC68HC908LV8CPBE vs MC9S12C32VPBE16)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case52-LQFP52-LQFP52-LQFP52-LQFP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 105°C (TA)
Supply Voltage2.35V ~ 5.5V4.5V ~ 5.5V2.7V ~ 5.5V2.35V ~ 5.5V
Core ProcessorHCS12HC11HC08HCS12
Core Size16-Bit8-Bit8-Bit16-Bit
RAM Size2K x 8512 x 8512 x 82K x 8
RoHSYesYesYesYes
Lifecycle StatusNot For New DesignsObsoleteObsoleteNot For New Designs
Data ConvertersA/D 8x10bA/D 8x8bA/D 6x10bA/D 8x10b
Number of I/O35384035
Oscillator TypeInternalInternalInternalInternal
Action

Cross Reference

Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .

This part is listed as a cross for

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