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NXP Semiconductors MC9S08RD8CPE Microcontroller, Microprocessor, FPGA Modules

IC MCU 8BIT 8KB FLASH 28DIP

1,746NXP Semiconductors28-DIP (0.600", 15.24mm)RoHS
MC9S08RD8CPE 28-DIP (0.600", 15.24mm) package illustration

Same model may have multiple batches, images only for reference.

MC9S08RD8CPE
Manufacturer
Part Number (MPN)
MC9S08RD8CPE
Detailed Description
IC MCU 8BIT 8KB FLASH 28DIP
Package
28-DIP (0.600", 15.24mm)
Key Features
Package / Case: 28-DIP (0.600", 15.24mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF MC9S08RD8CPE Datasheet
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Technical Specifications

NXP Semiconductors MC9S08RD8CPE Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
1K x 8
Package / Case
28-DIP
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.8V ~ 3.6V
Lifecycle Status
Obsolete
Peripherals
LVD, POR, PWM, WDT
Number of I/O
23
Speed
8MHz
Core Processor
S08

Alternate Parts Comparison (MC9S08RD8CPE vs MC908JL3ECPE vs MC908JL3EMPE vs MC68HC908JL3CP)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case28-DIP28-DIP28-DIP28-DIP
Mounting TypeThrough HoleThrough HoleThrough HoleThrough Hole
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)
Supply Voltage1.8V ~ 3.6V2.7V ~ 3.3V4.5V ~ 5.5V2.7V ~ 3.3V
Core ProcessorS08HC08HC08HC08
Core Size8-Bit8-Bit8-Bit8-Bit
RAM Size1K x 8128 x 8128 x 8128 x 8
Lifecycle StatusObsoleteObsoleteObsoleteObsolete
Number of I/O23232323
Oscillator TypeInternalExternalExternalExternal
PeripheralsLVD, POR, PWM, WDTLED, LVD, POR, PWMLED, LVD, POR, PWMLED, LVD, POR, PWM
Program Memory Size8KB (8K x 8)4KB (4K x 8)4KB (4K x 8)4KB (4K x 8)
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