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NXP Semiconductors MC705P6ECPE Microcontroller, Microprocessor, FPGA Modules

IC MCU 8BIT 4.5KB OTP 28DIP

5,751NXP Semiconductors28-DIP (0.600", 15.24mm)RoHS
MC705P6ECPE 28-DIP (0.600", 15.24mm) package illustration

Same model may have multiple batches, images only for reference.

MC705P6ECPE
Manufacturer
Part Number (MPN)
MC705P6ECPE
Detailed Description
IC MCU 8BIT 4.5KB OTP 28DIP
Package
28-DIP (0.600", 15.24mm)
Key Features
Package / Case: 28-DIP (0.600", 15.24mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF MC705P6ECPE Datasheet
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Technical Specifications

NXP Semiconductors MC705P6ECPE Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
HC05
RAM Size
176 x 8
RoHS
Yes
Package / Case
28-DIP
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
3V ~ 5.5V
Lifecycle Status
Obsolete
Peripherals
POR, WDT
Number of I/O
21

Alternate Parts Comparison (MC705P6ECPE vs MC908JL3EMPE vs MC9S08RD8CPE vs MC68HC908JL3CP)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case28-DIP28-DIP28-DIP28-DIP
Mounting TypeThrough HoleThrough HoleThrough HoleThrough Hole
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage3V ~ 5.5V4.5V ~ 5.5V1.8V ~ 3.6V2.7V ~ 3.3V
Core ProcessorHC05HC08S08HC08
Core Size8-Bit8-Bit8-Bit8-Bit
RAM Size176 x 8128 x 81K x 8128 x 8
Lifecycle StatusObsoleteObsoleteObsoleteObsolete
Number of I/O21232323
Oscillator TypeInternalExternalInternalExternal
PeripheralsPOR, WDTLED, LVD, POR, PWMLVD, POR, PWM, WDTLED, LVD, POR, PWM
Program Memory Size4.5KB (4.5K x 8)4KB (4K x 8)8KB (8K x 8)4KB (4K x 8)
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