NXP Semiconductors MC9S08QE8CTG Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 8KB FLASH 16TSSOP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S08QE8CTG
Detailed Description
IC MCU 8BIT 8KB FLASH 16TSSOP
Package
16-TSSOP (0.173, 4.40mm Width)
Key Features
Package / Case: 16-TSSOP (0.173, 4.40mm Width)
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC9S08QE8CTG Datasheet
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Technical Specifications
NXP Semiconductors MC9S08QE8CTG Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
S08
RAM Size
512 x 8
RoHS
Yes
Package / Case
16-TSSOP
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.8V ~ 3.6V
Lifecycle Status
Active
Peripherals
LVD, PWM, WDT
Speed
20MHz
Connectivity
I²C, LINbus, SCI, SPI
Alternate Parts Comparison (MC9S08QE8CTG vs MC705P6ACDWE vs MC711K4CFNE4 vs MC9S08SH16CTGR)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 16-TSSOP | 28-SOIC | 84-LCC | 16-TSSOP |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 1.8V ~ 3.6V | 5 V | 4.5V ~ 5.5V | 2.7V ~ 5.5V |
| Core Processor | S08 | HC05 | HC11 | S08 |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 512 x 8 | 176 B | 768 x 8 | 1K x 8 |
| Connectivity | I²C, LINbus, SCI, SPI | SIO | SCI, SPI | I²C, LINbus, SCI, SPI |
| Data Converters | A/D 8x12b | A/D 4x8b | A/D 8x8b | A/D 8x10b |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Peripherals | LVD, PWM, WDT | POR, WDT | POR, PWM, WDT | LVD, POR, PWM, WDT |
| Program Memory Size | 8KB (8K x 8) | 4.5KB (4.5K x 8) | 24KB (24K x 8) | 16KB (16K x 8) |
| Program Memory Type | Flash | OTP | OTP | Flash |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
This part is listed as a cross for
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