NXP Semiconductors MC9S08QA4CDNE Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 4KB FLASH 8SOIC
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S08QA4CDNE
Detailed Description
IC MCU 8BIT 4KB FLASH 8SOIC
Package
8-SOIC (0.154", 3.90mm Width)
Key Features
Package / Case: 8-SOIC (0.154", 3.90mm Width); Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC9S08QA4CDNE Datasheet
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Technical Specifications
NXP Semiconductors MC9S08QA4CDNE Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
256 x 8
RoHS
True
Package / Case
8-SOIC
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.8V ~ 3.6V
Lifecycle Status
Active
Peripherals
LVD, POR, PWM, WDT
Number of I/O
4
Speed
20MHz
Alternate Parts Comparison (MC9S08QA4CDNE vs MC9RS08KA2CSC vs MC9RS08KA1CSCR vs MC9S08QD2MSCR)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 8-SOIC | 8-SOIC | 8-SOIC | 8-SOIC |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) |
| Supply Voltage | 1.8V ~ 3.6V | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 2.7V ~ 5.5V |
| Core Processor | S08 | RS08 | RS08 | S08 |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 256 x 8 | 63 x 8 | 63 x 8 | 128 x 8 |
| Number of I/O | 4 | 4 | 4 | 4 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Peripherals | LVD, POR, PWM, WDT | LVD, POR, WDT | LVD, POR, WDT | LVD, POR, PWM, WDT |
| Program Memory Size | 4KB (4K x 8) | 2KB (2K x 8) | 1KB (1K x 8) | 2KB (2K x 8) |
| Program Memory Type | Flash | Flash | Flash | Flash |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
This part is listed as a cross for
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