NXP Semiconductors MC9S08QD2MSCR Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 2KB FLASH 8SOIC
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S08QD2MSCR
Detailed Description
IC MCU 8BIT 2KB FLASH 8SOIC
Package
8-SOIC (0.154", 3.90mm Width)
Key Features
Package / Case: 8-SOIC (0.154", 3.90mm Width); Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC9S08QD2MSCR Datasheet
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Technical Specifications
NXP Semiconductors MC9S08QD2MSCR Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
128 x 8
RoHS
Yes
Package / Case
8-SOIC
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.7V ~ 5.5V
Lifecycle Status
Active
Peripherals
LVD, POR, PWM, WDT
Number of I/O
4
Speed
16MHz
Alternate Parts Comparison (MC9S08QD2MSCR vs MC9RS08KA2CSC vs MC9RS08KA1CSCR vs TJA1050T/CM,118)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 8-SOIC | 8-SOIC | 8-SOIC | 8-SOIC |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Supply Voltage | 2.7V ~ 5.5V | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 4.75V ~ 5.25V |
| Lifecycle Status | Active | Active | Active | Active |
| Operating Temperature | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -- |
| Core Processor | S08 | RS08 | RS08 | -- |
| Core Size | 8-Bit | 8-Bit | 8-Bit | -- |
| RAM Size | 128 x 8 | 63 x 8 | 63 x 8 | -- |
| Number of I/O | 4 | 4 | 4 | -- |
| Oscillator Type | Internal | Internal | Internal | -- |
| Peripherals | LVD, POR, PWM, WDT | LVD, POR, WDT | LVD, POR, WDT | -- |
| Program Memory Size | 2KB (2K x 8) | 2KB (2K x 8) | 1KB (1K x 8) | -- |
| Action |
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