NXP Semiconductors MC9S08PL8SCTJR Microcontroller, Microprocessor, FPGA Modules
PL16S, 20TSSOP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S08PL8SCTJR
Detailed Description
PL16S, 20TSSOP
Package
20-TSSOP (0.173, 4.40mm Width)
Key Features
Package / Case: 20-TSSOP (0.173, 4.40mm Width)
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC9S08PL8SCTJR Datasheet
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Technical Specifications
NXP Semiconductors MC9S08PL8SCTJR Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
S08
RAM Size
1K x 8
Package / Case
20-TSSOP
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.7V ~ 5.5V
Peripherals
LVD, POR, PWM, WDT
Speed
20MHz
Connectivity
I²C, LINbus, SCI, UART/USART
Core Processor
HCS08
Numberof IO
18
Alternate Parts Comparison (MC9S08PL8SCTJR vs MC705P6ACDWE vs MC711K4CFNE4 vs MCIMX6D5EYM10AER)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 20-TSSOP | 28-SOIC | 84-LCC | 624-LFBGA, FCBGA |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -20°C ~ 105°C (TJ) |
| Core Processor | HCS08 | HC05 | HC11 | ARM® Cortex®-A9 |
| Speed | 20MHz | 2.1MHz | 4MHz | 1.0GHz |
| Series | S08 | -- | HC11 | i.MX6D |
| Supply Voltage | 2.7V ~ 5.5V | 5 V | 4.5V ~ 5.5V | -- |
| Core Size | 8-Bit | 8-Bit | 8-Bit | -- |
| RAM Size | 1K x 8 | 176 B | 768 x 8 | -- |
| Connectivity | I²C, LINbus, SCI, UART/USART | SIO | SCI, SPI | -- |
| Data Converters | A/D 12x10b SAR | A/D 4x8b | A/D 8x8b | -- |
| Oscillator Type | External, Internal | Internal | Internal | -- |
| Peripherals | LVD, POR, PWM, WDT | POR, WDT | POR, PWM, WDT | -- |
| Action |
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