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NXP Semiconductors LPC802M011JDH20J Microcontroller, Microprocessor, FPGA Modules

LPC802M011JDH20

7,500 ActiveNXP Semiconductors20-TSSOP (0.173, 4.40mm Width)RoHS
LPC802M011JDH20J - No Image Available

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LPC802M011JDH20J
Manufacturer
Part Number (MPN)
LPC802M011JDH20J
Detailed Description
LPC802M011JDH20
Package
20-TSSOP (0.173, 4.40mm Width)
Key Features
Package / Case: 20-TSSOP (0.173, 4.40mm Width)
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF LPC802M011JDH20J Datasheet
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Technical Specifications

NXP Semiconductors LPC802M011JDH20J Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
LPC80xM
RAM Size
2K x 8
Package / Case
20-TSSOP
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
1.71V ~ 3.6V
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Speed
15MHz
Connectivity
I²C, SPI, UART/USART
Core Processor
ARM® Cortex®-M0+
Numberof IO
16

Alternate Parts Comparison (LPC802M011JDH20J vs LPC11C24FBD48/301 vs LPC812M101JDH20FP vs LPC2292FBD144/01,5)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Operating Temperature-40°C ~ 105°C (TA)-40 °C ~ 85 °C-40°C ~ 105°C (TA)-40°C ~ 85°C (TA)
Supply Voltage1.71V ~ 3.6V3.3 V3.3 V1.8 V
RAM Size2K x 88 kB4 kB16 kB
PeripheralsBrown-out Detect/Reset, POR, PWM, WDTPOR, WDTBrown-out Detect/Reset, POR, PWM, WDTI2C, PWM
Package / Case20-TSSOP--20-TSSOP144-LQFP
Core ProcessorARM® Cortex®-M0+--ARM® Cortex®-M0+ARM7®
Core Size32-Bit--32-Bit Single-Core16/32-Bit
ConnectivityI²C, SPI, UART/USART--I²C, SPI, UART/USARTCANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Oscillator TypeExternal, Internal--InternalInternal
Program Memory Size16KB (16K x 8)--16KB (16K x 8)256KB (256K x 8)
Program Memory TypeFlash--FlashFlash
Speed15MHz--30MHz60MHz
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