NXP Semiconductors MC9S08GT32ACFBE Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 32KB FLASH 44QFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S08GT32ACFBE
Detailed Description
IC MCU 8BIT 32KB FLASH 44QFP
Package
44-QFP
Key Features
Package / Case: 44-QFP; Mounting Type: Surface Mount
Lifecycle Status
NRND
RoHS State
RoHS Compliant
Datasheet
MC9S08GT32ACFBE Datasheet
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Technical Specifications
NXP Semiconductors MC9S08GT32ACFBE Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
2K x 8
Package / Case
44-QFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.8V ~ 3.6V
Peripherals
LVD, POR, PWM, WDT
Number of I/O
36
Speed
40MHz
Core Processor
S08
Program Memory Type
Flash
Alternate Parts Comparison (MC9S08GT32ACFBE vs MC68L11D0CFBE2 vs MC68HC705C9ACFBE vs MC908JB8FBE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 44-QFP | 44-QFP | 44-QFP | 44-QFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | 0°C ~ 70°C (TA) |
| Supply Voltage | 1.8V ~ 3.6V | 3V ~ 5.5V | 3V ~ 5.5V | 4V ~ 5.5V |
| Core Processor | S08 | HC11 | HC05 | HC08 |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 2K x 8 | 192 x 8 | 352 x 8 | 256 x 8 |
| Connectivity | I²C, SCI, SPI | SCI, SPI | SCI, SPI | USB |
| Number of I/O | 36 | 26 | 24 | 37 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Peripherals | LVD, POR, PWM, WDT | POR, WDT | POR, WDT | LVD, POR, PWM |
| Program Memory Type | Flash | ROMless | OTP | Flash |
| Action |
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