NXP Semiconductors MC68L11D0CFBE2 Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT ROMLESS 44QFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC68L11D0CFBE2
Detailed Description
IC MCU 8BIT ROMLESS 44QFP
Package
44-QFP
Key Features
Package / Case: 44-QFP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
MC68L11D0CFBE2 Datasheet
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Technical Specifications
NXP Semiconductors MC68L11D0CFBE2 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
192 x 8
Package / Case
44-QFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
3V ~ 5.5V
Peripherals
POR, WDT
Number of I/O
26
Speed
2MHz
Core Processor
HC11
Program Memory Type
ROMless
Alternate Parts Comparison (MC68L11D0CFBE2 vs MC908GP32CFBE vs MC68HC908GT16CFB vs MC68HC908AP8CFB)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 44-QFP | 44-QFP | 44-QFP | 44-QFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 3V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V |
| Core Processor | HC11 | HC08 | HC08 | HC08 |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 192 x 8 | 512 x 8 | 512 x 8 | 1K x 8 |
| Connectivity | SCI, SPI | SCI, SPI | SCI, SPI | I²C, IRSCI, SCI, SPI |
| Number of I/O | 26 | 33 | 36 | 32 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Peripherals | POR, WDT | LVD, POR, PWM | LVD, POR, PWM | LED, LVD, POR, PWM |
| Program Memory Type | ROMless | Flash | Flash | Flash |
| Action |
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