NXP Semiconductors MC9S08FL16CBM Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 16KB FLASH 32SDIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S08FL16CBM
Detailed Description
IC MCU 8BIT 16KB FLASH 32SDIP
Package
32-SDIP (0.400", 10.16mm)
Key Features
Package / Case: 32-SDIP (0.400", 10.16mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
MC9S08FL16CBM Datasheet
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Technical Specifications
NXP Semiconductors MC9S08FL16CBM Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
1K x 8
RoHS
Yes
Package / Case
32-SDIP
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
4.5V ~ 5.5V
Lifecycle Status
Obsolete
Peripherals
LVD, PWM, WDT
Number of I/O
30
Speed
20MHz
Alternate Parts Comparison (MC9S08FL16CBM vs MC705P6ACDWE vs MC711K4CFNE4 vs MC908JL16CSPE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 32-SDIP | 28-SOIC | 84-LCC | 32-SDIP |
| Mounting Type | Through Hole | Surface Mount | Surface Mount | Through Hole |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 4.5V ~ 5.5V | 5 V | 4.5V ~ 5.5V | 2.7V ~ 5.5V |
| Core Processor | S08 | HC05 | HC11 | HC08 |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 1K x 8 | 176 B | 768 x 8 | 512 x 8 |
| Lifecycle Status | Obsolete | Not For New Designs | Obsolete | Obsolete |
| Connectivity | SCI | SIO | SCI, SPI | I²C, SCI |
| Data Converters | A/D 12x8b | A/D 4x8b | A/D 8x8b | A/D 13x10b |
| Number of I/O | 30 | 21 | 62 | 26 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Action |
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