NXP Semiconductors MC9RS08KA2CDB Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 2KB FLASH 6DFN

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9RS08KA2CDB
Detailed Description
IC MCU 8BIT 2KB FLASH 6DFN
Package
6-VDFN Exposed Pad
Key Features
Package / Case: 6-VDFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC9RS08KA2CDB Datasheet
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Technical Specifications
NXP Semiconductors MC9RS08KA2CDB Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
63 x 8
RoHS
True
Package / Case
6-VDFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.8V ~ 5.5V
Lifecycle Status
Active
Peripherals
LVD, POR, WDT
Number of I/O
2
Speed
10MHz
Alternate Parts Comparison (MC9RS08KA2CDB vs MC705P6ACDWE vs MC711K4CFNE4 vs MC9RS08KA1CDB)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 6-VDFN Exposed Pad | 28-SOIC | 84-LCC | 6-VDFN Exposed Pad |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 1.8V ~ 5.5V | 5 V | 4.5V ~ 5.5V | 1.8V ~ 5.5V |
| Core Processor | RS08 | HC05 | HC11 | RS08 |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 63 x 8 | 176 B | 768 x 8 | 63 x 8 |
| Number of I/O | 2 | 21 | 62 | 2 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Peripherals | LVD, POR, WDT | POR, WDT | POR, PWM, WDT | LVD, POR, WDT |
| Program Memory Size | 2KB (2K x 8) | 4.5KB (4.5K x 8) | 24KB (24K x 8) | 1KB (1K x 8) |
| Program Memory Type | Flash | OTP | OTP | Flash |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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