NXP Semiconductors MC56F82313VLC Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 16KB FLASH 32LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC56F82313VLC
Detailed Description
IC MCU 32BIT 16KB FLASH 32LQFP
Package
32-LQFP
Key Features
Package / Case: 32-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC56F82313VLC Datasheet
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Technical Specifications
NXP Semiconductors MC56F82313VLC Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
2K x 16
RoHS
True
Package / Case
32-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
2.7V ~ 3.6V
Lifecycle Status
Active
Peripherals
DMA, POR, PWM, WDT
Number of I/O
26
Speed
50MHz
Alternate Parts Comparison (MC56F82313VLC vs MC9S08AC16CFJER vs MC9S08FL8CLC vs MC908GR48ACFJE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 32-LQFP | 32-LQFP | 32-LQFP | 32-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 2.7V ~ 3.6V | 2.7V ~ 5.5V | 4.5V ~ 5.5V | 3V ~ 5.5V |
| Core Processor | 56800EX | S08 | S08 | HC08 |
| Core Size | 32-Bit Single-Core | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 2K x 16 | 1K x 8 | 768 x 8 | 1.5K x 8 |
| Connectivity | I²C, SCI, SPI | I²C, SCI, SPI | SCI | SCI, SPI |
| Data Converters | A/D 6x12b | A/D 6x10b | A/D 12x8b | A/D 24x10b |
| Number of I/O | 26 | 22 | 30 | 21 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Peripherals | DMA, POR, PWM, WDT | LVD, POR, PWM, WDT | LVD, PWM, WDT | LVD, POR, PWM |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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