NXP Semiconductors MC56F8025VLD Microcontrollers
IC MCU 16BIT 32KB FLASH 44LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC56F8025VLD
Base Model
Detailed Description
IC MCU 16BIT 32KB FLASH 44LQFP
Package
44-LQFP
Lifecycle Status
Active
Datasheet
MC56F8025VLD Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors MC56F8025VLD Microcontrollers technical specifications.
General
RAM Size
2K x 16
RoHS
Yes
Package / Case
44-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
3V ~ 3.6V
Lifecycle Status
Active
Peripherals
POR, PWM, WDT
Number of I/O
35
Speed
32MHz
Related Parts Comparison (MC56F8025VLD vs MC56F84451VLF vs MC56F8002VWLR vs MC56F8165VFGE)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Package / Case | 44-LQFP | 48-LQFP | 28-SOIC | 128-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) |
| Supply Voltage | 3V ~ 3.6V | 3V ~ 3.6V | 1.8V ~ 3.6V | 2.25V ~ 3.6V |
| Core Processor | 56800E | 56800EX | 56800E | 56800E |
| Core Size | 16-Bit | 32-Bit Single-Core | 16-Bit | 16-Bit |
| RAM Size | 2K x 16 | 16K x 8 | 1K x 16 | 16K x 16 |
| RoHS | Yes | Yes | Yes | Yes |
| Lifecycle Status | Active | Active | Active | Active |
| Connectivity | I²C, LINbus, SCI, SPI | CANbus, I²C, LINbus, SCI, SPI | I²C, LINbus, SCI, SPI | EBI/EMI, SCI, SPI |
| Data Converters | A/D 8x12b; D/A 2x12b | A/D 10x10b | A/D 15x12b | A/D 16x12b |
| Number of I/O | 35 | 39 | 23 | 49 |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
This part is listed as a cross for
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