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NXP Semiconductors MC56F8322MFAE Microcontroller, Microprocessor, FPGA Modules

IC MCU 16BIT 32KB FLASH 48LQFP

38,465NXP Semiconductors48-LQFPRoHS
MC56F8322MFAE - No Image Available

Same model may have multiple batches, images only for reference.

MC56F8322MFAE
Manufacturer
Part Number (MPN)
MC56F8322MFAE
Detailed Description
IC MCU 16BIT 32KB FLASH 48LQFP
Package
48-LQFP
Key Features
Package / Case: 48-LQFP; Mounting Type: Surface Mount
Lifecycle Status
NRND
RoHS State
RoHS Compliant
Datasheet
PDF MC56F8322MFAE Datasheet
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Technical Specifications

NXP Semiconductors MC56F8322MFAE Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
6K x 16
Package / Case
48-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.25V ~ 3.6V
Peripherals
POR, PWM, Temp Sensor, WDT
Number of I/O
21
Speed
60MHz
Core Processor
56800E
Program Memory Type
Flash

Alternate Parts Comparison (MC56F8322MFAE vs MC908GZ48CFAE vs MM912F634CV2APR2 vs S9S12G128AVLF)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case48-LQFP48-LQFP48-LQFP48-LQFP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)-40°C ~ 105°C-40°C ~ 105°C (TA)
Supply Voltage2.25V ~ 3.6V3V ~ 5.5V2.25V ~ 5.5V3.13V ~ 5.5V
Core Processor56800EHC08S1212V1
RAM Size6K x 161.5K x 82K x 88K x 8
Number of I/O2137940
Program Memory TypeFlashFlashFLASH (32kB)Flash
Core Size16-Bit8-Bit--16-Bit
ConnectivityCANbus, SCI, SPICANbus, SCI, SPI--CANbus, IrDA, LINbus, SCI, SPI
Data ConvertersA/D 6x12bA/D 24x10b--A/D 12x10b
Oscillator TypeInternalInternal--Internal
Action

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