NXP Semiconductors MC34PF8100F3EP Power Management - Specialized
POWER MANAGEMENT IC I.MX8 PRE-PR
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC34PF8100F3EP
Detailed Description
POWER MANAGEMENT IC I.MX8 PRE-PR
Package
56-VFQFN Exposed Pad
Key Features
Package / Case: 56-VFQFN Exposed Pad; Mounting Type: Surface Mount, Wettable Flank
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC34PF8100F3EP Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors MC34PF8100F3EP Power Management - Specialized technical specifications.
General
RoHS
Yes
Package / Case
56-VFQFN Exposed Pad
Mounting Type
Surface Mount, Wettable Flank
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
2.5V ~ 5.5V
Lifecycle Status
Active
Applications
High Performance i.MX 8, S32x Processor Based
Suggetrslprc
$4.96
Partstatusdescja
Fully qualified to meet NXP quality and reliability requirements. Available for production quantity orders.
Min Order Qty
4000
Alternate Parts Comparison (MC34PF8100F3EP vs MC33FS8405G0ESR2 vs MC33PF8200CLESR2 vs MC33PF8100EPESR2)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 56-VFQFN Exposed Pad | 56-VFQFN Exposed Pad | 56-VFQFN Exposed Pad | 56-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank | Surface Mount, Wettable Flank | Surface Mount, Wettable Flank | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) |
| Supply Voltage | 2.5V ~ 5.5V | 60V | 2.5V ~ 5.5V | 2.5V ~ 5.5V |
| Applications | High Performance i.MX 8, S32x Processor Based | -- | High Performance i.MX 8, S32x Processor Based | High Performance i.MX 8, S32x Processor Based |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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