NXP Semiconductors MC33FS4503CAE Power Management - Specialized
SYSTEM BASIS CHIP LINEAR 0.5A V
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC33FS4503CAE
Detailed Description
SYSTEM BASIS CHIP LINEAR 0.5A V
Package
48-LQFP Exposed Pad
Key Features
Package / Case: 48-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC33FS4503CAE Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors MC33FS4503CAE Power Management - Specialized technical specifications.
General
RoHS
Yes
Package / Case
48-LQFP Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C
Supply Voltage
1V ~ 5V
Lifecycle Status
Active
Applications
System Basis Chip
Issimilarsample
Yes
Pack Type
REEL
Price Flg
Y
Alternate Parts Comparison (MC33FS4503CAE vs MC33907LAER2 vs MC33908LAE vs MC33814AE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 48-LQFP Exposed Pad | 48-LQFP Exposed Pad | 48-LQFP Exposed Pad | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C ~ 125°C | -40°C ~ 125°C (TA) | -40°C ~ 125°C | -40°C ~ 125°C |
| RoHS | Yes | Yes | Yes | Yes |
| Lifecycle Status | Active | Active | Active | Active |
| Package | 48-HLQFP (7x7) | SOT1571-1 | 48-LQFPExposedPad | LQFP-48 |
| Mounting Type | Surface Mount | -- | Surface Mount | Surface Mount |
| Supply Voltage | 1V ~ 5V | 3.3V, 5V | -- | 4.5V ~ 36V |
| Applications | System Basis Chip | -- | Power Supply, Automotive Applications | Small Engine |
| Issimilarsample | Yes | Yes | Yes | -- |
| Pack Desc | Reel 13" Q2/T3 in Drypack | Reel 13" Q2/T3 in Drypack | Reel 13" Q2/T3 in Drypack | -- |
| Pack Type | REEL | REEL | REEL | -- |
| Price Flg | Y | Y | Y | -- |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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