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NXP Semiconductors MC33FS6513CAER2 Power Management - Specialized

SYSTEM BASIS CHIP DCDC 1.5A VCO

10,920 ActiveNXP Semiconductors48-LQFP Exposed PadRoHS
MC33FS6513CAER2 - No Image Available

Same model may have multiple batches, images only for reference.

MC33FS6513CAER2
Manufacturer
Part Number (MPN)
MC33FS6513CAER2
Detailed Description
SYSTEM BASIS CHIP DCDC 1.5A VCO
Package
48-LQFP Exposed Pad
Key Features
Package / Case: 48-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MC33FS6513CAER2 Datasheet
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Technical Specifications

NXP Semiconductors MC33FS6513CAER2 Power Management - Specialized technical specifications.

General

Package / Case
48-LQFP Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C
Supply Voltage
1V ~ 5V
Applications
System Basis Chip

Alternate Parts Comparison (MC33FS6513CAER2 vs MC33907LAER2 vs MC33908LAE vs MC33814AE)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case48-LQFP Exposed Pad48-LQFP Exposed Pad48-LQFP Exposed Pad48-LQFP Exposed Pad
Operating Temperature-40°C ~ 125°C-40°C ~ 125°C (TA)-40°C ~ 125°C-40°C ~ 125°C
Mounting TypeSurface Mount--Surface MountSurface Mount
Supply Voltage1V ~ 5V3.3V, 5V--4.5V ~ 36V
ApplicationsSystem Basis Chip--Power Supply, Automotive ApplicationsSmall Engine
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