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NXP Semiconductors LPC822M101JHI33K Microcontrollers

IC MCU 32BIT 16KB FLASH 32HVQFN

8 ActiveNXP Semiconductors32-VFQFN Exposed Pad$2.75
LPC822M101JHI33K 32-VFQFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

LPC822M101JHI33K
Manufacturer
Part Number (MPN)
LPC822M101JHI33K
Detailed Description
IC MCU 32BIT 16KB FLASH 32HVQFN
Package
32-VFQFN Exposed Pad
Key Features
Package: 32-VFQFN Exposed Pad
Lifecycle Status
Active
Datasheet
PDF LPC822M101JHI33K Datasheet
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Technical Specifications

NXP Semiconductors LPC822M101JHI33K Microcontrollers technical specifications.

General

RAM Size
4K x 8
RoHS
Yes
Package / Case
32-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
1.8V ~ 3.6V
Lifecycle Status
Active
Package
32-VFQFN Exposed Pad
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O
29

Alternate Parts Comparison (LPC822M101JHI33K vs LPC824M201JHI33K vs A7001CGHN1/T1AGAEL vs S9S12ZVLS3AMFMR)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case32-VFQFN Exposed Pad32-VFQFN Exposed Pad32-VFQFN Exposed Pad32-VFQFN Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount, Wettable Flank
Operating Temperature-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)-25°C ~ 85°C-40°C ~ 125°C (TA)
Supply Voltage1.8V ~ 3.6V1.8V ~ 3.6V1.62V ~ 5.5V5.5V ~ 18V
Core ProcessorARM® Cortex®-M0+ARM® Cortex®-M0+MX51S12Z
RAM Size4K x 88K x 83.2kB1K x 8
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveActive
Package32-VFQFN Exposed Pad32-VFQFNExposedPadHVQFN EP-32QFN-32
Program Memory TypeFlashFlashEEPROM (76.4kB)Flash
Core Size32-Bit Single-Core32-Bit Single-Core--16-Bit
ConnectivityI²C, SPI, UART/USARTI²C, SPI, UART/USART--I²C, IrDA, LINbus, SCI, SPI, UART/USART
Action

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