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NXP Semiconductors LPC802M001JHI33Y Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 16KB FLASH 33HVQFN

7,200 ActiveNXP Semiconductors32-VFQFN Exposed PadRoHS
LPC802M001JHI33Y 32-VFQFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

LPC802M001JHI33Y
Manufacturer
Part Number (MPN)
LPC802M001JHI33Y
Detailed Description
IC MCU 32BIT 16KB FLASH 33HVQFN
Package
32-VFQFN Exposed Pad
Key Features
Package / Case: 32-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF LPC802M001JHI33Y Datasheet
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Technical Specifications

NXP Semiconductors LPC802M001JHI33Y Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
2K x 8
RoHS
Yes
Package / Case
32-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
1.71V ~ 3.6V
Lifecycle Status
Active
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O
17
Speed
15MHz

Alternate Parts Comparison (LPC802M001JHI33Y vs LPC824M201JHI33K vs A7001CGHN1/T1AGAEL vs S9S12ZVLS3AMFMR)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case32-VFQFN Exposed Pad32-VFQFN Exposed Pad32-VFQFN Exposed Pad32-VFQFN Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount, Wettable Flank
Operating Temperature-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)-25°C ~ 85°C-40°C ~ 125°C (TA)
Supply Voltage1.71V ~ 3.6V1.8V ~ 3.6V1.62V ~ 5.5V5.5V ~ 18V
Core ProcessorARM® Cortex®-M0+ARM® Cortex®-M0+MX51S12Z
RAM Size2K x 88K x 83.2kB1K x 8
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveActive
Package32-VFQFN32-VFQFNExposedPadHVQFN EP-32QFN-32
Program Memory TypeFlashFlashEEPROM (76.4kB)Flash
Core Size32-Bit Single-Core32-Bit Single-Core--16-Bit
ConnectivityI²C, SPI, UART/USARTI²C, SPI, UART/USART--I²C, IrDA, LINbus, SCI, SPI, UART/USART
Action

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