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NXP Semiconductors LPC802M001JHI33Y Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 16KB FLASH 33HVQFN

7,200 ActiveNXP Semiconductors32-VFQFN Exposed PadRoHS
LPC802M001JHI33Y - No Image Available

Same model may have multiple batches, images only for reference.

LPC802M001JHI33Y
Manufacturer
Part Number (MPN)
LPC802M001JHI33Y
Detailed Description
IC MCU 32BIT 16KB FLASH 33HVQFN
Package
32-VFQFN Exposed Pad
Key Features
Package / Case: 32-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF LPC802M001JHI33Y Datasheet
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Technical Specifications

NXP Semiconductors LPC802M001JHI33Y Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
2K x 8
Package / Case
32-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
1.71V ~ 3.6V
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O
17
Speed
15MHz
Core Processor
ARM® Cortex®-M0+
Program Memory Type
Flash

Alternate Parts Comparison (LPC802M001JHI33Y vs LPC824M201JHI33K vs A7001CGHN1/T1AGAEL vs S9S12ZVLS3AMFMR)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case32-VFQFN Exposed Pad32-VFQFN Exposed Pad32-VFQFN Exposed Pad32-VFQFN Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount, Wettable Flank
Operating Temperature-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)-25°C ~ 85°C-40°C ~ 125°C (TA)
Supply Voltage1.71V ~ 3.6V1.8V ~ 3.6V1.62V ~ 5.5V5.5V ~ 18V
Core ProcessorARM® Cortex®-M0+ARM® Cortex®-M0+MX51S12Z
RAM Size2K x 88K x 83.2kB1K x 8
Program Memory TypeFlashFlashEEPROM (76.4kB)Flash
Core Size32-Bit Single-Core32-Bit Single-Core--16-Bit
ConnectivityI²C, SPI, UART/USARTI²C, SPI, UART/USART--I²C, IrDA, LINbus, SCI, SPI, UART/USART
Data ConvertersA/D 12x12bA/D 12x12b--A/D 6x10b
Number of I/O1729--18
Oscillator TypeInternalInternal--External, Internal
Action

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