NXP Semiconductors LPC55S28JBD100Y Microcontroller, Microprocessor, FPGA Modules
HIGH EFFICIENCY ARM CORTEX -M33
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC55S28JBD100Y
Detailed Description
Package
100-LQFP Exposed Pad
Key Features
Package / Case: 100-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
LPC55S28JBD100Y Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors LPC55S28JBD100Y Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
100-LQFP Exposed Pad
Supplier Device Package
100-HLQFP (14x14)
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O
64
Speed
150MHz
Core Processor
ARM® Cortex®-M33
RAM Size
256K x 8
Program Memory Type
Flash
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.