NXP Semiconductors LPC55S26JBD100K Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 256KB FLSH 100HLQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC55S26JBD100K
Detailed Description
Package
100-LQFP Exposed Pad
Key Features
Package / Case: 100-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
LPC55S26JBD100K Datasheet
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Technical Specifications
NXP Semiconductors LPC55S26JBD100K Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
100-LQFP Exposed Pad
Supplier Device Package
100-HLQFP (14x14)
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O
64
Speed
150MHz
Core Processor
ARM® Cortex®-M33
RAM Size
144K x 8
Program Memory Type
Flash
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