NXP Semiconductors LPC5534JBD100MP Microcontroller, Microprocessor, FPGA Modules
ARM CORTEX-M33-BASED MICROCONTRO
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC5534JBD100MP
Detailed Description
Package
100-LQFP Exposed Pad
Key Features
Package / Case: 100-LQFP Exposed Pad
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
LPC5534JBD100MP Datasheet
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Technical Specifications
NXP Semiconductors LPC5534JBD100MP Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Package / Case
100-LQFP Exposed Pad
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Speed
150MHz
Connectivity
CANbus, I²C, SPI, UART/USART, USB
Operating Temperature
-40°C ~ 105°C (TA)
Core Processor
ARM® Cortex®-M33
RAM Size
96K x 8
Numberof IO
66
Program Memory Type
Flash
Core Size
32-Bit
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