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NXP Semiconductors LPC1830FBD144K Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT ROMLESS 144LQFP

1,986 ActiveNXP Semiconductors144-LQFPRoHS
LPC1830FBD144K 144-LQFP package illustration

Same model may have multiple batches, images only for reference.

LPC1830FBD144K
Manufacturer
Part Number (MPN)
LPC1830FBD144K
Detailed Description
IC MCU 32BIT ROMLESS 144LQFP
Package
144-LQFP
Key Features
Package / Case: 144-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF LPC1830FBD144K Datasheet
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Technical Specifications

NXP Semiconductors LPC1830FBD144K Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
LPC18xx
RAM Size
200K x 8
RoHS
Yes
Package / Case
144-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.2V ~ 3.6V
Lifecycle Status
Active
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O
83

Related Parts Comparison (LPC1830FBD144K vs MC68EN302AG20BT vs SPC5643LF2MLQ8 vs S912XEP100J5VAGR)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case144-LQFP144-LQFP144-LQFP144-LQFP
Operating Temperature-40°C ~ 85°C (TA)0°C ~ 70°C (TA)-40°C ~ 125°C (TA)-40°C ~ 105°C (TA)
Core ProcessorARM® Cortex®-M3M68000e200z4HCS12X
Lifecycle StatusActiveObsoleteActiveActive
Speed180MHz20MHz80MHz50MHz
Mounting TypeSurface Mount--Surface MountSurface Mount
Supply Voltage2.2V ~ 3.6V--3V ~ 5.5V1.72V ~ 5.5V
Core Size32-Bit Single-Core--32-Bit Dual-Core16-Bit
RAM Size200K x 8--128K x 864K x 8
RoHSYesYes--Yes
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG--CANbus, FlexRay, LINbus, SPI, UART/USARTCANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Data ConvertersA/D 8x10b; D/A 1x10b--A/D 32x12bA/D 24x12b
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