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NXP Semiconductors LPC1830FBD144K Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT ROMLESS 144LQFP

1,986 ActiveNXP SemiconductorsLPC18xx144-LQFPRoHS
LPC1830FBD144K - No Image Available

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LPC1830FBD144K
Manufacturer
Part Number (MPN)
LPC1830FBD144K
Series
Detailed Description
IC MCU 32BIT ROMLESS 144LQFP
Package
144-LQFP
Key Features
Package / Case: 144-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF LPC1830FBD144K Datasheet
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Technical Specifications

NXP Semiconductors LPC1830FBD144K Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
200K x 8
Package / Case
144-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.2V ~ 3.6V
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O
83
Speed
180MHz
Core Processor
ARM® Cortex®-M3
Program Memory Type
ROMless

Alternate Parts Comparison (LPC1830FBD144K vs MC68EN302AG20BT vs SPC5643LF2MLQ8 vs S912XEP100J5VAGR)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case144-LQFP144-LQFP144-LQFP144-LQFP
Operating Temperature-40°C ~ 85°C (TA)0°C ~ 70°C (TA)-40°C ~ 125°C (TA)-40°C ~ 105°C (TA)
Core ProcessorARM® Cortex®-M3M68000e200z4HCS12X
Speed180MHz20MHz80MHz50MHz
Mounting TypeSurface Mount--Surface MountSurface Mount
Supply Voltage2.2V ~ 3.6V--3V ~ 5.5V1.72V ~ 5.5V
Core Size32-Bit Single-Core--32-Bit Dual-Core16-Bit
RAM Size200K x 8--128K x 864K x 8
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG--CANbus, FlexRay, LINbus, SPI, UART/USARTCANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Data ConvertersA/D 8x10b; D/A 1x10b--A/D 32x12bA/D 24x12b
Oscillator TypeInternal--InternalExternal
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, WDT--DMA, POR, PWM, WDTLVD, POR, PWM, WDT
Action

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