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NXP Semiconductors LPC1343FHN33,518 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 32KB FLASH 32HVQFN

19,020 ActiveNXP Semiconductors32-VQFN Exposed PadRoHS
LPC1343FHN33,518 32-VQFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

LPC1343FHN33,518
Manufacturer
Part Number (MPN)
LPC1343FHN33,518
Detailed Description
IC MCU 32BIT 32KB FLASH 32HVQFN
Package
32-VQFN Exposed Pad
Key Features
Package / Case: 32-VQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF LPC1343FHN33,518 Datasheet
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Technical Specifications

NXP Semiconductors LPC1343FHN33,518 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
8K x 8
RoHS
Yes
Package / Case
32-VQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2V ~ 3.6V
Lifecycle Status
Active
Peripherals
Brown-out Detect/Reset, POR, WDT
Number of I/O
28
Speed
72MHz

Alternate Parts Comparison (LPC1343FHN33,518 vs LPC1114FHI33/303K vs LPC1112FHN33/201,5 vs LPC1114FHN33/301K)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case32-VQFN Exposed Pad32-VQFN Exposed Pad32-VQFN Exposed Pad32-VQFN Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage2V ~ 3.6V1.8V ~ 3.6V1.8V ~ 3.6V1.8V ~ 3.6V
Core ProcessorARM® Cortex®-M3ARM® Cortex®-M0ARM® Cortex®-M0ARM® Cortex®-M0
Core Size32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size8K x 88K x 84K x 84K x 8
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveActive
ConnectivityI²C, Microwire, SPI, SSI, SSP, UART/USART, USBI²C, SPI, UART/USARTI²C, SPI, UART/USARTI²C, SPI, UART/USART
Data ConvertersA/D 8x10bA/D 8x10b SARA/D 8x10bA/D 8x10b SAR
Number of I/O28282828
Action

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