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NXP Semiconductors LPC1112FHN33/201,5 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 16KB FLASH 32HVQFN

34,045 ActiveNXP Semiconductors32-VQFN Exposed PadRoHS
LPC1112FHN33/201,5 32-VQFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

LPC1112FHN33/201,5
Manufacturer
Part Number (MPN)
LPC1112FHN33/201,5
Detailed Description
IC MCU 32BIT 16KB FLASH 32HVQFN
Package
32-VQFN Exposed Pad
Key Features
Package / Case: 32-VQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF LPC1112FHN33/201,5 Datasheet
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Technical Specifications

NXP Semiconductors LPC1112FHN33/201,5 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
4K x 8
RoHS
Yes
Package / Case
32-VQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.8V ~ 3.6V
Lifecycle Status
Active
Peripherals
Brown-out Detect/Reset, POR, WDT
Number of I/O
28
Speed
50MHz

Alternate Parts Comparison (LPC1112FHN33/201,5 vs LPC1114FHI33/303K vs LPC1114FHN33/301K vs LPC1112FHN33/101,5)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case32-VQFN Exposed Pad32-VQFN Exposed Pad32-VQFN Exposed Pad32-VQFN Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage1.8V ~ 3.6V1.8V ~ 3.6V1.8V ~ 3.6V1.8V ~ 3.6V
Core ProcessorARM® Cortex®-M0ARM® Cortex®-M0ARM® Cortex®-M0ARM® Cortex®-M0
Core Size32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size4K x 88K x 84K x 82K x 8
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveActive
ConnectivityI²C, SPI, UART/USARTI²C, SPI, UART/USARTI²C, SPI, UART/USARTI²C, SPI, UART/USART
Data ConvertersA/D 8x10bA/D 8x10b SARA/D 8x10b SARA/D 8x10b
Number of I/O28282828
Action

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