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NXP Semiconductors LPC11U35FHI33/501Y Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 64KB FLASH 33HVQFN

14,028 ActiveNXP Semiconductors32-VFQFN Exposed PadRoHS
LPC11U35FHI33/501Y - No Image Available

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LPC11U35FHI33/501Y
Manufacturer
Part Number (MPN)
LPC11U35FHI33/501Y
Detailed Description
IC MCU 32BIT 64KB FLASH 33HVQFN
Package
32-VFQFN Exposed Pad
Key Features
Package / Case: 32-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF LPC11U35FHI33/501Y Datasheet
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Technical Specifications

NXP Semiconductors LPC11U35FHI33/501Y Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
12K x 8
Package / Case
32-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.8V ~ 3.6V
Peripherals
Brown-out Detect/Reset, POR, WDT
Number of I/O
26
Speed
50MHz
EEPROM Size
4K x 8
Core Processor
ARM® Cortex®-M0

Alternate Parts Comparison (LPC11U35FHI33/501Y vs LPC824M201JHI33K vs A7001CGHN1/T1AGAEL vs MKL15Z64VFM4R)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case32-VFQFN Exposed Pad32-VFQFN Exposed Pad32-VFQFN Exposed Pad32-VFQFN Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount, Wettable Flank
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 105°C (TA)-25°C ~ 85°C-40°C ~ 105°C (TA)
Supply Voltage1.8V ~ 3.6V1.8V ~ 3.6V1.62V ~ 5.5V1.71V ~ 3.6V
Core ProcessorARM® Cortex®-M0ARM® Cortex®-M0+MX51ARM® Cortex®-M0+
RAM Size12K x 88K x 83.2kB8K x 8
Program Memory TypeFlashFlashEEPROM (76.4kB)Flash
Core Size32-Bit Single-Core32-Bit Single-Core--32-Bit Single-Core
ConnectivityI²C, Microwire, SmartCard, SPI, SSP, UART/USART, USBI²C, SPI, UART/USART--I²C, LINbus, SPI, TSI, UART/USART
Data ConvertersA/D 8x10bA/D 12x12b--A/D 9x16b; D/A 1x12b
Number of I/O2629--28
Oscillator TypeInternalInternal--Internal
Action

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