Skip to main content

Micron Technology Inc. MT61K512M32KPA-16:E DRAM

DRAM Memory IC 16G POD125/POD135 2 GHz TFBGA-180

285 ActiveMicron Technology Inc.FBGA$382.35RoHS
MT61K512M32KPA-16:E - No Image Available

Same model may have multiple batches, images only for reference.

MT61K512M32KPA-16:E
Part Number (MPN)
MT61K512M32KPA-16:E
Detailed Description
DRAM Chip GDDR6 SGRAM 16Gbit 512Mx32 1.35V 180-Pin FBGA
Package
FBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MT61K512M32KPA-16:E Datasheet
Quick Jump:
Ready to order?In stock and ready to ship.
Competitive Pricing
Fast & Reliable Delivery
Quality Assured

Technical Specifications

Micron Technology Inc. MT61K512M32KPA-16:E DRAM technical specifications.

General

Interface
POD125/POD135
Memory Size
16G
Data Bus Width
32 bit
Maximum Clock Frequency
2 GHz
RoHS
Compliant
Number of Pins
180
Package / Case
TFBGA-180
Packaging
Tray
Mounting Type
Surface Mount
Operating Temperature
0 ~ 95

Alternate Parts Comparison (MT61K512M32KPA-16:E vs MT47H128M16HG-3:A vs MT41K128M16JT-125:K vs MT41K128M16JT-107:K)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0 ~ 950 ~ 850°C ~ 95°C (TC)0°C ~ 95°C (TC)
Supply Voltage1.2125/1.3095 ~ 1.2875/1.30951.81.283V ~ 1.45V1.283V ~ 1.45V
Memory Size16G2G2G2G
Number of Pins180849696
RoHSCompliantCompliantCompliantCompliant
Lifecycle StatusActiveObsoleteActiveActive
Address Bus Width Bit18171717
Data Bus Width Bit32161616
Dram TypeGDDR6 SGRAMDDR2 SDRAMDDR3L SDRAMDDR3L SDRAM
Fbga Marking CodeD8DZJD9JJBD9PTKD9PSZ
Maximum Clock Rate Mhz150066716001866
Action

More Parts in DRAM

Browse additional parts from the same category, grouped by series, package type, and manufacturer. These are catalog suggestions — not verified pin-compatible alternates.