Microchip Technology PIC18LF26K80-I/SP Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 64KB FLASH 28SPDIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
PIC18LF26K80-I/SP
Detailed Description
Package
28-DIP (0.300, 7.62mm)
Key Features
Package / Case: 28-DIP (0.300, 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
PIC18LF26K80-I/SP Datasheet
Quick Jump:
Technical Specifications
Microchip Technology PIC18LF26K80-I/SP Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Package / Case
28-DIP (0.300, 7.62mm)
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Speed
64MHz
Connectivity
ECANbus, I²C, LINbus, SPI, UART/USART
Series
PIC® XLP™ 18K
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 85°C (TA)
Core Processor
PIC
RAM Size
3.6K x 8
Numberof IO
24
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.