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Microchip Technology PIC18F23K20-E/SP Microcontroller, Microprocessor, FPGA Modules

IC MCU 8BIT 8KB FLASH 28SPDIP

10,710 ActiveMicrochip Technology28-DIP (0.300, 7.62mm)RoHS
PIC18F23K20-E/SP - No Image Available

Same model may have multiple batches, images only for reference.

PIC18F23K20-E/SP
Part Number (MPN)
PIC18F23K20-E/SP
Detailed Description
IC MCU 8BIT 8KB FLASH 28SPDIP
Package
28-DIP (0.300, 7.62mm)
Key Features
Package / Case: 28-DIP (0.300, 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF PIC18F23K20-E/SP Datasheet
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Technical Specifications

Microchip Technology PIC18F23K20-E/SP Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
PIC® XLP™ 18K
RAM Size
512 x 8
Package / Case
28-DIP
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
1.8V ~ 3.6V
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Speed
48MHz
Connectivity
I²C, SPI, UART/USART
Core Processor
PIC

Alternate Parts Comparison (PIC18F23K20-E/SP vs PIC18F24Q71-I/SP vs PIC16F17155-I/SP vs PIC16F1782-E/SP)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
SeriesPIC® XLP™ 18KPIC® Q71PIC® 16FPIC® XLP™ 16F
Package / Case28-DIP28-DIP28-DIP28-DIP
Mounting TypeThrough HoleThrough HoleThrough HoleThrough Hole
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 125°C (TA)
Supply Voltage1.8V ~ 3.6V1.8V ~ 5.5V1.8V ~ 5.5V2.3V ~ 5.5V
Core ProcessorPICPICPICPIC
Core Size8-Bit8-Bit8-Bit8-Bit
RAM Size512 x 81K x 81K x 8256 x 8
ConnectivityI²C, SPI, UART/USARTI²C, LINbus, RS-232, RS-485, SPI, UART/USARTI²C, LINbus, RS-232, RS-485, SPI, UART/USARTI²C, LINbus, SPI, UART/USART
Data ConvertersA/D 11x10bA/D 24x12b SAR; D/A 2x8b, 1x10bA/D 42x12b; D/A 2x8bA/D 11x12b; D/A 1x8b
Numberof IO24262424
Oscillator TypeInternalExternal, InternalExternal, InternalInternal
Action

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