Microchip Technology PIC16F1782-E/SP Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 3.5KB FLASH 28SPDIP

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
PIC16F1782-E/SP
Series
Detailed Description
IC MCU 8BIT 3.5KB FLASH 28SPDIP
Package
28-DIP (0.300, 7.62mm)
Key Features
Package / Case: 28-DIP (0.300, 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PIC16F1782-E/SP Datasheet
Quick Jump:
Technical Specifications
Microchip Technology PIC16F1782-E/SP Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
PIC® XLP™ 16F
RAM Size
256 x 8
Package / Case
28-DIP
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.3V ~ 5.5V
Peripherals
Brown-out Detect/Reset, POR, PSMC, PWM, WDT
Speed
32MHz
Connectivity
I²C, LINbus, SPI, UART/USART
Core Processor
PIC
Alternate Parts Comparison (PIC16F1782-E/SP vs PIC16F18424 vs PIC16F1575 vs PIC16F1828)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Series | PIC® XLP™ 16F | -- | -- | -- |
| Package / Case | 28-DIP | -- | -- | -- |
| Mounting Type | Through Hole | -- | -- | -- |
| Operating Temperature | -40°C ~ 125°C (TA) | -- | -- | -- |
| Supply Voltage | 2.3V ~ 5.5V | -- | -- | -- |
| Core Processor | PIC | -- | -- | -- |
| Core Size | 8-Bit | -- | -- | -- |
| RAM Size | 256 x 8 | -- | -- | -- |
| Connectivity | I²C, LINbus, SPI, UART/USART | -- | -- | -- |
| Data Converters | A/D 11x12b; D/A 1x8b | -- | -- | -- |
| EEPROM Size | 256 x 8 | -- | -- | -- |
| Numberof IO | 24 | -- | -- | -- |
| Action |
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