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Analog Devices ADUCM331WACPZ Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 128KB FLASH 32LFCSP

83Analog Devices32-VFQFN Exposed Pad, CSP$19.40RoHS
ADUCM331WACPZ - No Image Available

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ADUCM331WACPZ
Manufacturer
Part Number (MPN)
ADUCM331WACPZ
Detailed Description
IC MCU 32BIT 128KB FLASH 32LFCSP
Package
32-VFQFN Exposed Pad, CSP
Key Features
Package / Case: 32-VFQFN Exposed Pad, CSP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF ADUCM331WACPZ Datasheet
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Technical Specifications

Analog Devices ADUCM331WACPZ Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
6K x 8
Package / Case
32-VFQFN Exposed Pad, CSP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 115°C (TA)
Supply Voltage
3.6V ~ 18V
Lifecycle Status
Obsolete
Peripherals
POR, WDT
Number of I/O
6
Speed
16.384MHz
EEPROM Size
4K x 8

Alternate Parts Comparison (ADUCM331WACPZ vs ADUCM300WBCPZ vs ADUCM330WFSBCPZ-RL vs ADUCM330WDCPZ-RL)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case32-VFQFN Exposed Pad, CSP32-VFQFN Exposed Pad, CSP32-VFQFN Exposed Pad, CSP32-VFQFN Exposed Pad, CSP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 115°C (TA)-40°C ~ 115°C (TA)-40°C ~ 115°C (TA)-40°C ~ 115°C (TA)
Supply Voltage3.6V ~ 18V3.6V ~ 18V3.6V ~ 19V3.6V ~ 18V
Core ProcessorARM® Cortex®-M3ARM® Cortex®-M3ARM® Cortex®-M3ARM® Cortex®-M3
Core Size32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size6K x 86K x 810K x 86K x 8
ConnectivityLINbus, SPILINbus, SPILINbus, SPILINbus, SPI
EEPROM Size4K x 84K x 84K x 84K x 8
Number of I/O6666
Oscillator TypeInternalInternalInternalInternal
PeripheralsPOR, WDTPOR, WDTPOR, WDTPOR, WDT
Action

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