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Analog Devices ADUCM330WDCPZ-RL Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 96KB FLASH 32LFCSP

5,550Analog Devices32-VFQFN Exposed Pad, CSP$26.09RoHS
ADUCM330WDCPZ-RL - No Image Available

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ADUCM330WDCPZ-RL
Manufacturer
Part Number (MPN)
ADUCM330WDCPZ-RL
Detailed Description
IC MCU 32BIT 96KB FLASH 32LFCSP
Package
32-VFQFN Exposed Pad, CSP
Key Features
Package / Case: 32-VFQFN Exposed Pad, CSP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF ADUCM330WDCPZ-RL Datasheet
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Technical Specifications

Analog Devices ADUCM330WDCPZ-RL Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
6K x 8
Package / Case
32-VFQFN Exposed Pad, CSP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 115°C (TA)
Supply Voltage
3.6V ~ 18V
Peripherals
POR, WDT
Number of I/O
6
Speed
16.384MHz
EEPROM Size
4K x 8
Core Processor
ARM® Cortex®-M3

Alternate Parts Comparison (ADUCM330WDCPZ-RL vs ADUCM300WBCPZ vs ADUCM330WFSBCPZ-RL vs ADV7391BCPZ-REEL)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case32-VFQFN Exposed Pad, CSP32-VFQFN Exposed Pad, CSP32-VFQFN Exposed Pad, CSP32-VFQFN Exposed Pad, CSP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 115°C (TA)-40°C ~ 115°C (TA)-40°C ~ 115°C (TA)--
Supply Voltage3.6V ~ 18V3.6V ~ 18V3.6V ~ 19V--
Core ProcessorARM® Cortex®-M3ARM® Cortex®-M3ARM® Cortex®-M3--
Core Size32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core--
RAM Size6K x 86K x 810K x 8--
ConnectivityLINbus, SPILINbus, SPILINbus, SPI--
EEPROM Size4K x 84K x 84K x 8--
Number of I/O666--
Oscillator TypeInternalInternalInternal--
PeripheralsPOR, WDTPOR, WDTPOR, WDT--
Action

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