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AMD/Xilinx XC6SLX75T-4FGG484C FPGAs (Field Programmable Gate Array)

IC FPGA 268 I/O 484FBGA

In StockAMD/XilinxXC6SLX75FBGARoHS
XC6SLX75T-4FGG484C FBGA package illustration

Same model may have multiple batches, images only for reference.

XC6SLX75T-4FGG484C
Manufacturer
Part Number (MPN)
XC6SLX75T-4FGG484C
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology. Features 3096 Kbit RAM, 264 18x18 multipliers, 132 dedicated DSP slices, and 8 transceiver blocks operating at 3.2 Gbps. This surface-mount device is housed in a 484-pin, 23mm x 23mm x 1.7mm Fine Pitch Ball Grid Array (FBGA) package with a 1mm pin pitch. Offers 268 maximum user I/Os and operates within a temperature range of 0°C to 85°C.
Package
FBGA
Key Features
Package: FBGA
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF XC6SLX75T-4FGG484C Datasheet
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Ordering Code Family

XC6SLX75 groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

83 ordering variants listed on the family page.

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Technical Specifications

AMD/Xilinx XC6SLX75T-4FGG484C FPGAs (Field Programmable Gate Array) technical specifications.

General

RoHS
Yes
Number of Pins
484
Package / Case
484-BBGA
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C (TJ)
Supply Voltage
1.14V ~ 1.26V
Lifecycle Status
Obsolete
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package
FBGA

Alternate Parts Comparison (XC6SLX75T-4FGG484C vs XC6SLX75-3CSG484I vs XC6SLX75-3FGG484C vs XC6SLX75-2CSG484I)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0°C ~ 85°C (TJ)-40°C ~ 100°C (TJ)0°C ~ 85°C (TJ)-40°C ~ 100°C (TJ)
PackageFBGA484-FBGA, CSPBGA484-BBGA484-FBGA, CSPBGA
Package / Case484-BBGA484-FBGA484-BBGA484-FBGA
Supply Voltage1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V
Number of I/O268328280328
Number of LABs/CLBs5831583158315831
Number of Logic Elements Cells74637746377463774637
Total RAM Bits3170304317030431703043170304
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AMD/Xilinx XC6SLX75T-4FGG484C FPGAs (Field Programmable Gate Array) Overview

Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology. Features 3096 Kbit RAM, 264 18x18 multipliers, 132 dedicated DSP slices, and 8 transceiver blocks operating at 3.2 Gbps. This surface-mount device is housed in a 484-pin, 23mm x 23mm x 1.7mm Fine Pitch Ball Grid Array (FBGA) package with a 1mm pin pitch.

Offers 268 maximum user I/Os and operates within a temperature range of 0°C to 85°C.

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