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AMD/Xilinx XC6SLX75T-2FGG676C FPGAs (Field Programmable Gate Array)

IC FPGA 348 I/O 676FBGA

60 ActiveAMD/XilinxXC6SLX75FBGA$4011.15RoHS
XC6SLX75T-2FGG676C FBGA package illustration

Same model may have multiple batches, images only for reference.

XC6SLX75T-2FGG676C
Manufacturer
Part Number (MPN)
XC6SLX75T-2FGG676C
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology. Features 3,096 Kbit RAM bits, 132 dedicated DSP slices, and 264 18x18 multipliers. Includes 8 transceiver blocks operating at 3.2 Gbps and 1 PCI block. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with a 1mm pin pitch and dimensions of 27mm x 27mm x 1.73mm. Operates within a temperature range of 0°C to 85°C.
Package
FBGA
Key Features
Package: FBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF XC6SLX75T-2FGG676C Datasheet
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Ordering Code Family

XC6SLX75 groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

83 ordering variants listed on the family page.

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Technical Specifications

AMD/Xilinx XC6SLX75T-2FGG676C FPGAs (Field Programmable Gate Array) technical specifications.

General

Series
XC6SLX75T
RoHS
Yes
Number of Pins
676
Package / Case
676-BGA
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C (TJ)
Supply Voltage
1.14V ~ 1.26V
Lifecycle Status
Active
Basic Package Type
Ball Grid Array
Package Family Name
BGA

Alternate Parts Comparison (XC6SLX75T-2FGG676C vs XC6SLX75-3CSG484I vs XC6SLX75-3FGG484C vs XC6SLX75-2CSG484I)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
SeriesXC6SLX75TXC6SLX75XC6SLX75XC6SLX75
Package / Case676-BGA484-FBGA484-BBGA484-FBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0°C ~ 85°C (TJ)-40°C ~ 100°C (TJ)0°C ~ 85°C (TJ)-40°C ~ 100°C (TJ)
Supply Voltage1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveActive
Adaptive Logic Modules Alms11662 ALM11662 ALM11662 ALM11662 ALM
Collector Emitter Saturation Voltage1.2 V1.2 V1.2 V1.2 V
Distributed RAM692 kbit692 kbit692 kbit692 kbit
Embedded Block RAM Ebr3096 kbit3096 kbit3096 kbit3096 kbit
Maximum Operating Frequency1.08 GHz1.08 GHz1.08 GHz1.08 GHz
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AMD/Xilinx XC6SLX75T-2FGG676C FPGAs (Field Programmable Gate Array) Overview

Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology. Features 3,096 Kbit RAM bits, 132 dedicated DSP slices, and 264 18x18 multipliers. Includes 8 transceiver blocks operating at 3.2 Gbps and 1 PCI block. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with a 1mm pin pitch and dimensions of 27mm x 27mm x 1.73mm.

Operates within a temperature range of 0°C to 85°C.

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