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AMD/Xilinx XC6SLX75T-4FG484I FPGAs (Field Programmable Gate Array)

Field Programmable Gate Array (FPGA) featuring 74,637 logic cells and 45nm process technology.

In Stock ActiveAMD/XilinxXC6SLX75FBGARoHS
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XC6SLX75T-4FG484I
Manufacturer
Part Number (MPN)
XC6SLX75T-4FG484I
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) featuring 74,637 logic cells and 45nm process technology. This device offers 268 maximum user I/Os, 93,296 registers, and 3,096 Kbit of RAM. It includes 132 dedicated DSP slices, 264 18x18 multipliers, and 8 transceiver blocks operating at 3.2 Gbps. The FPGA is housed in a 484-pin Fine Pitch Ball Grid Array (FBGA) package with a 1mm pin pitch, suitable for surface mounting. Operating temperature range is -40°C to 100°C.
Package
FBGA
Key Features
Package: FBGA
Lifecycle Status
Active
RoHS State
No
Datasheet
PDF XC6SLX75T-4FG484I Datasheet
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Ordering Code Family

XC6SLX75 groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

83 ordering variants listed on the family page.

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Technical Specifications

AMD/Xilinx XC6SLX75T-4FG484I FPGAs (Field Programmable Gate Array) technical specifications.

General

RoHS
No
Number of Pins
484
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pcb
484

Alternate Parts Comparison (XC6SLX75T-4FG484I vs XC6SLX75-3CSG484I vs XC6SLX75-3FGG484C vs XC6SLX75-2CSG484I)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 100°C-40°C ~ 100°C (TJ)0°C ~ 85°C (TJ)-40°C ~ 100°C (TJ)
PackageFBGA484-FBGA, CSPBGA484-BBGA484-FBGA, CSPBGA
Package / Case--484-CSPBGA484-FBGA484-CSPBGA
Supply Voltage--1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V
Number of I/O--328280328
Number of LABs/CLBs--583158315831
Number of Logic Elements Cells--746377463774637
Total RAM Bits--317030431703043170304
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AMD/Xilinx XC6SLX75T-4FG484I FPGAs (Field Programmable Gate Array) Overview

Field Programmable Gate Array (FPGA) featuring 74,637 logic cells and 45nm process technology. This device offers 268 maximum user I/Os, 93,296 registers, and 3,096 Kbit of RAM. It includes 132 dedicated DSP slices, 264 18x18 multipliers, and 8 transceiver blocks operating at 3.2 Gbps. The FPGA is housed in a 484-pin Fine Pitch Ball Grid Array (FBGA) package with a 1mm pin pitch, suitable for surface mounting.

Operating temperature range is -40°C to 100°C.

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